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| Name | Common design challenges with advanced semiconductor packaging |
| Video Uploader | Video From Siemens Software |
| Upload Date | This Video Uploaded At 22-02-2022 19:27:52 |
| Video Discription | Learn about common design challenges when creating advanced semiconductor packaging. By watching the video, you will learn about different design solutions for physical design and verification of advanced semiconductor packages and 2.5 heterogenous assemblies. xPD supports all substrate types including silicon interposers with industry leading capacity and performance. To learn more about advanced semiconductor packaging design software, please visit: https://eda.sw.siemens.com/en-US/ic-packaging/xpedition-package-designer/ ▶️ Connect with us: » LinkedIn: https://www.linkedin.com/showcase/pcb-systems-design » Blog: https://blogs.sw.siemens.com/semiconductor-packaging/?cmpid=9050 » IC Packaging Community Discussion Board: https://community.sw.siemens.com/s/topic/0TO4O000000NhSVWA0/ic-packaging?cmpid=9050 » Twitter: https://twitter.com/siemenssoftware #Semiconductor #ElectricalEngineering #Engineering #ICdesign oJaC6vZ8r3o |
| Category | Science & Technology |
| Tags | Science & Technology Download MP4 | Science & Technology Download MP3 | Science & Technology Download MP4 360p | Science & Technology Download MP4 480p | Science & Technology Download MP4 720p | Science & Technology Download MP4 1080p |
